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High speed inter-chip (HSIC) compatible PHY IP
High speed inter-chip (HSIC) compatible PHY IP
New Products |
Evatronix SA, provider of USB-IF certified solutions for SuperSpeed USB 3.0 and USB 2.0 IP, has announced a High Speed…
ST-Ericsson launches the Igloo open source community
ST-Ericsson launches the Igloo open source community
Technology News |
ST-Ericsson has launched the Igloo open source community together with a developer board, the Snowball, to accelerate the development of…
64-core 40G ATCA packet processor blade
64-core 40G ATCA packet processor blade
New Products |
Kontron unveiled the 40GbE ATCA packet processor blade AT8242 designed with two powerful OCTEON II cnMIPS64 multi-core processors from Cavium…
Cortex-M3 gets a GUI
Cortex-M3 gets a GUI
New Products |
Express Logic and Blue Water Embedded have brought the PrismX GUI Toolkit to STMicroelectronics' STM32 Platform. The GUI software development…

GSA opens European office
GSA opens European office
Market news |
The European Headquarters of the Global Semiconductor Alliance is to be located in Geneva, Switzerland. The opening of its European offices comes with the hiring of Sandro Grigolli as its…
Industry-specific test packages for EMC
Industry-specific test packages for EMC
New Products |
TESEQ has released Compliance 5, a single, integrated emission and immunity test software platform for performing all RF EMC testing needs. The upgraded software has a Commercial Application Package included…
SoC integrates power with audio and touch-screen controller
SoC integrates power with audio and touch-screen controller
New Products |
Maxim Integrated Products has developed a range of integrated Power System-on-Chip (Power SoC) devices that combine power management with mixed-signal functions such as digital audio, a high-speed interface, and a…
Multi-core processor for LTE eNodeB / base stations
Multi-core processor for LTE eNodeB / base stations
New Products |
The XLP316L multi-core, multi-threaded processor designed by NetLogic Microsystems is optimized to deliver the highest performance for next-generation LTE base stations. The multi-core processor integrates sixteen NXCPUs, and features a…
EMC test software with industry-specific test packages
EMC test software with industry-specific test packages
New Products |
Teseq has released Compliance 5 emission and immunity test software, a single, integrated test platform capable of performing all RF EMC testing needs. The upgraded software is simple to use…
USB oscilloscopes operate from 60 to 200 MHz at 500 MS/s
USB oscilloscopes operate from 60 to 200 MHz at 500 MS/s
New Products |
The latest dual-channel PC Oscilloscopes in the PicoScope 3000 Series offer bandwidths from 60 MHz to 200 MHz. These compact and economical devices include valuable features such as serial decoding,…
Industrial cameras with dedicated color software tools
Industrial cameras with dedicated color software tools
New Products |
PPT Vision introduced twenty-six new Impact M-Series color cameras with dedicated color Impact software tools for sorting, monitoring and identifying color objects. Color M-Series camera models range from economical VGA…
IEEE spec aims to ease mobile congestion
IEEE spec aims to ease mobile congestion
Market news |
The IEEE is drafting a standard that aims to help strike a difficult balance between the needs of carriers to ease rapidly growing congestion on mobile networks with the needs…
Testing multicore software
Testing multicore software
Feature articles |
Hardware verification engineers have always faced the complexity of concurrent execution and temporal considerations when verifying hardware designs. However, silicon manufacturers are now moving to multicore designs (i.e. multiple CPU…
Baseband SoC vendor licenses MIPS core
Baseband SoC vendor licenses MIPS core
Market news |
Taiwanese baseband SoC vendor Mobile Devices Inc.has licensed the MIPS32 M14Kc core for development of SoCs targeting wireless and mobile applications, MIPS Technologies Inc. said Monday (Feb. 14).
Qualcomm puts quad-core on LTE roadmap
Qualcomm puts quad-core on LTE roadmap
Technology News |
Qualcomm Inc. came to the Mobile World Congress this week unveiling its road map for integrated and standalone LTE silicon—including an integrated quad-core processor--using 28nm process technology.
IC firms roll combo chips at Mobile Congress
IC firms roll combo chips at Mobile Congress
Technology News |
Fabless chip makers Broadcom Corp. and Atheros Communications Inc. introduced new combo chips Monday (Feb. 14), the opening day of Mobile World Congress 2011 in Barcelona, Spain. Rival chip maker…
System design using NAND flash memory
System design using NAND flash memory
Feature articles |
NAND flash error correcting code (ECC) has been on the rise since NAND was first introduced. Although it’s not a new issue, the ECC required to support newer multilevel (MLC)…
Intel invests $26 million in six startups
Intel invests $26 million in six startups
Business news |
Intel Capital, the venture capital arm of the world's largest chip maker, announced Monday (Feb. 14) $26 million worth of deals to fund six startups related to the mobile hardware…
Baseband mania hits Mobile World
Baseband mania hits Mobile World
Market news |
Intel, Marvell, MediaTek, Qualcomm and others have rolled out baseband devices-or cell-phone chipsets-for handsets and other products.
Nvidia nabs pair of tablet design wins
Nvidia nabs pair of tablet design wins
Market news |
Nvidia Corp.'s Tegra 2 mobile processor landed the key socket in media tablets announced at 2011 Mobile World Congress by LG Electronics Co. and Samsung Electronics Co. Ltd.
Bosch, Opel develop innovative infotainment system
Bosch, Opel develop innovative infotainment system
Partners |
Together with Opel, Bosch has developed an “all-in-one” infotainment system for Opel's new Corsa subcompact model. The Touch & Connect system combines audio, navigation and communications functions in one compact…
U-blox and Rohde & Schwarz team up on Galileo and GLONASS development
U-blox and Rohde & Schwarz team up on Galileo and GLONASS development
Business news |
U-blox and Rohde & Schwarz have successfully concluded a simulation of the soon-to-be-deployed European Galileo satellite positioning system.
Nokia/Microsoft alliance carries downside for cell phone giant
Nokia/Microsoft alliance carries downside for cell phone giant
Business news |
Nokia's agreement with Microsoft to make Windows Phone 7 its principal operating system is likely to have a negative near-term impact on the mobile handset leader's smart phone shipments.
Skyworks powering multiple LTE platforms
Skyworks powering multiple LTE platforms
Business news |
Skyworks Solutions has announced that its extensive LTE product portfolio continues to gain traction with leading handset OEMs and smart phone providers and is at the heart of several new,…
Touchless gesturing brings innovation to product designs
Touchless gesturing brings innovation to product designs
Technology News |
Ahsan Javed, Human Interface Product Manager, Silicon Laboratories Inc, says the day will soon come when commonplace home appliances will be activated and controlled with the wave of a hand…
Smartphones raise profile, prospects for analog/mixed-signal ICs
Smartphones raise profile, prospects for analog/mixed-signal ICs
Technology News |
There has been a major shift in the cell phone market, with smartphones gaining prominence over feature phones in the past few years. The paradigm shift in phones has created…
High efficiency, low voltage conversion with single supply operation from an LDO regulator
High efficiency, low voltage conversion with single supply operation from an LDO regulator
Technology News |
Steve Knoth, Senior Product Marketing Engineer, Power Products Group, Linear Technology Corporation outlines how a new LDO technology overcomes some fundamental power design challenges while minimizing performance tradeoffs.
Using copper pillars to increase analog IC power dissipation
Using copper pillars to increase analog IC power dissipation
Technology News |
Vince Stueve and Sean Montgomery, Micrel Inc. examines how copper pillars can be used to increase analog IC power dissipation…


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