{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/test.ecinews.fr\/fr\/","author_name":"eeNews Europe","author_url":"https:\/\/test.ecinews.fr\/fr\/author\/eenews-europe\/","title":"Kit d'\u00e9valuation de FPGA Plug-In-&amp;-Go","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"Ma2t4KDbTi\"><a href=\"https:\/\/test.ecinews.fr\/fr\/kit-devaluation-de-fpga-plug-in-go\/\">Kit d&rsquo;\u00e9valuation de FPGA Plug-In-&amp;-Go<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/test.ecinews.fr\/fr\/kit-devaluation-de-fpga-plug-in-go\/embed\/#?secret=Ma2t4KDbTi\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0Kit d&rsquo;\u00e9valuation de FPGA Plug-In-&amp;-Go\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"Ma2t4KDbTi\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/test.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/import\/eci6562_lattice-icestick-pr.jpg","thumbnail_width":1200,"thumbnail_height":906,"description":"Constitu\u00e9 d\u2019une carte de d\u00e9veloppement au format d'un disque USB facile \u00e0 utiliser, le kit d\u2019\u00e9valuation iCEstick de Lattice Semiconductor permet aux ing\u00e9nieurs et aux architectes syst\u00e8mes d'\u00e9valuer et de d\u00e9velopper rapidement des solutions mobiles bas\u00e9es sur la famille iCE40 mobileFPGA propri\u00e9taire, des FPGA con\u00e7us pour r\u00e9pondre au march\u00e9 des appareils mobiles. Cet \u00e9quipement acc\u00e9l\u00e8re le d\u00e9veloppement d'une solution en int\u00e9grant, outre le FPGA, des fonctions mat\u00e9rielles et des conceptions de r\u00e9f\u00e9rence destin\u00e9es aux fonctions infrarouges et de capteurs pour les smartphones, tablettes, consoles de jeux et de nombreuses autres applications."}